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Thorough removal of particles with just air and no water - 'Air Screw Nozzle'

Revolutionary! No need for water washing! Particles are removed with just air blow.

<Compatible with Class 100! Can be used for cleaning semiconductors> This air nozzle utilizes a patented unique technology that significantly surpasses the air ejection power of conventional air nozzles. With powerful air blowing, it removes particles adhered to semiconductors. (Compatible with Class 100) In other words, the cleaning process that previously required three steps—1. water washing ⇒ 2. water draining ⇒ 3. drying—has been transformed. It can now be completed in one step using only "air blow" without water. This drastically shortens the process. ■ Benefit 1: Increased productivity and production volume The entire process of water washing, water draining, and drying is replaced by cleaning with air blow only. This means that water washing, water draining, and drying are no longer necessary, leading to a significant improvement in productivity and production volume. ■ Benefit 2: Improved operational efficiency and cost reduction As mentioned above, the elimination of the entire process allows for substantial cost cuts on personnel, various equipment, running costs of those equipment, electricity fees, and other expenses that were previously allocated to that process. ■ Benefit 3: Improved yield With cleaning power that is incomparable to other air nozzles, it contributes to improved yield. This helps enhance production efficiency.

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  • Other semiconductor manufacturing equipment
  • Dynamic air blow nozzle

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